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Huawei developed a new die-on-board packaging, which directly mounted NAND dies on the SSD PCB, to get around the sanctions that prevented it from acquiring high-layer-count 3D NAND chips that used American tech. This allowed the company to pile in more 3D NAND on its storage devices without the...
May 23, 2026 · 1 min read
Class-action lawsuit filed against HDD suspension assembly makers
May 22, 2026 · 1 min read